Xrf analysis laboratories by MicroVision Laboratories today? Problem: A client was a manufacturer of beverages, bottled water, and other drinks. They received a customer complaint through one of their distributors, which indicated that a customer had been drinking a bottle of water, and as they neared the bottom of the bottle, found a mysterious white powder floating in the bottom. The customer returned the bottle and complained. The client hoped to identify the powder so they could both satisfy their end customer, as well as identify any potential problems in their manufacturing or bottling process.
Translucent or transparent coatings on metallic or semi-conductor substrates are very difficult to image due to their reflective nature. Nomarski/DIC imaging is an effective method for accentuating differences in thickness, density or the optical index in these cases. This analysis enhances and highlights subtle features with brilliant color gradients and captures them with a high resolution digital imaging system. Let us bring out your sample’s hidden features.
What is your standard turnaround time (TAT) and can it be expedited? Our standard TAT is 5 to 10 business days. We can provide faster TATs on request with the following surcharges: – Same day to 24 hour rush is 100% surcharge – 2 day rush is 75% surcharge – 3 day rush is 50% surcharge – 4 day rush is 25% surcharge Rush requests must have prior approval otherwise we cannot guarantee turnaround times. Read even more details on visit their site. We are proud to announce that MicroVision Labs is now accredited to the ISO/IEC 17025:2017 standard. This represents over a year of diligent effort from all of our staff to verify and validate our in house SOP’s and transform our quality management system to one that is compliant to this international standard. This certification requires that accredited labs demonstrate that they are competent and can produce technically valid data and results unlike other certifications such as ISO 9001:2015. This represents an obvious value to our clients.
Dust samples were analyzed using polarized light microscopy (PLM) to provide percentages of the particle types present in the samples. MVL was able to determine that there was significant loading of glass fibers in the dust samples with the likely source being contractor’s work in the attic which involved disturbing the fiberglass insulation. The image on the right shows a few distinct glass fibers with a binder material adhered to them, consistent with fiberglass insulation.
The profile of the flow of the solder at these bonds was documented using the SEM with backscatter imaging, which correlates brightness in the image with atomic density. Some voids were found in the solder as shown the SEM image. An EDS spectrum of the solder was acquired which showed that the solder was a tin/lead (80/20) solder. The EDS map clearly shows the copper wire and copper pad (red) with the tin lead solder (light blue) that appears to have flowed well and made a good bond between the copper elements. This map also shows the fiberglass bundles that add structural integrity to the board. See a few extra info on here.